Method for preserving a mark on a metallic workpiece

ABSTRACT

The present invention relates to a method for preserving a mark on a metallic workpiece prior to a chemical etching process to remove a surface material from a surface of the workpiece carrying the mark, the method comprising the steps of: deepening the mark relative to the surface to form a first depth; and depositing a filling material into the first depth, wherein the filling material is adapted to be removed during the chemical process, such that a second depth is obtained at the mark after the chemical process. The present invention also relates to a method of treating a metallic workpiece to preserve a mark on the surface of the workpiece, the method comprising the step of treating at least a portion of the surface of the workpiece surrounding the mark to remove at least a surface oxide layer from the mark, the treating step being arranged such that it does not remove all of the surface material from said portion of the surface of the workpiece, but removes at least the surface oxide layer from the mark.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/137,935, filed 25 Apr. 2016. The patent application identified aboveis incorporated here by reference in its entirety to provide continuityof disclosure.

FIELD OF THE INVENTION

The invention relates to a method for preserving a mark on a metallicworkpiece, particularly but not exclusively, to a method for preservinga mark on a metallic workpiece which will be processed by a chemicalsurface processing step.

BACKGROUND OF THE INVENTION

A number of chemical methods have been conventionally applied to etch,clean or generally, process surfaces of a metallic workpiece for a clearand consistent finish or aesthetically enhanced appearance. For example,workpieces of aluminium and/or aluminium alloys are often surfaceprocessed by etching in an aqueous sodium hydroxide solution (NaOH (aq))(also called “caustic solution” or “caustic soda”) to remove the surfacematerial prior to anodization. This etching step will generally producea basic surface finish which prepares the workpiece for the subsequent,anodizing steps.

One issue of the caustic surface processing is that the chemical etchinginvolved is a non-selective process and therefore, any markings such assigns, logos or indicia which have been previously provided on thesurface of the workpiece, will also be removed along with the surfacematerial of the workpiece and therefore the markings are not retained.

OBJECTS OF THE INVENTION

An object of the present invention is to provide a method for surfaceprocessing a metallic workpiece, in which the aforesaid shortcoming ismitigated or obviated to some degree or at least to provide a usefulalternative.

Another object of the present invention is to mitigate or obviate tosome degree one or more problems associated with known surfaceprocessing methods for metallic workpieces.

The above objects are met by the combination of features of the mainclaims; the sub-claims disclose further advantageous embodiments of theinvention.

One skilled in the art will derive from the following description otherobjects of the invention. Therefore, the foregoing statements of objectare not exhaustive and serve merely to illustrate some of the manyobjects of the present invention.

SUMMARY OF THE INVENTION

In a first main aspect, the invention provides a method for preserving amark on a metallic workpiece prior to a chemical process to remove asurface material from a surface of the workpiece carrying the mark, themethod comprising the steps of: deepening the mark relative to thesurface to form a first depth; and depositing a filling material intothe first depth, wherein the filling material is adapted to be removedduring the chemical process, such that a second depth is obtained at themark after the chemical process.

Preferably, the mark on the metallic workpiece comprises an etch oranneal mark and the chemical process is a chemical etching process.

Preferably, the step of deepening the mark relative to the surface toform a first depth comprises reacting a surface of the mark with anacidic solution.

Preferably, the filling material is a metallic material.

Preferably, the metallic filling material is a different metallicmaterial to that of the workpiece.

Preferably, the step of depositing the filling material comprises anelectrochemical reaction in the presence of a metal ion-containingelectrolyte solution at the first depth of the mark.

Preferably, the chemical process comprises etching with an alkalinesolution.

Preferably, the surface of the workpiece is anodized.

Preferably, the chemical process comprises removing at least an oxidelayer from the surface material of the workpiece.

Preferably, the method further comprising a step of treating the surfaceof the workpiece carrying the mark prior to the step of deepening themark relative to the surface to form a first depth.

Preferably, the treating step comprises removing at least a surfaceoxide layer from the mark.

Preferably, the treating step is applied to at least a portion of thesurface of the work piece surrounding the mark, but is such that it doesnot remove all of the surface material from said portion of the surfaceof the workpiece, but removes at least the surface oxide layer from themark.

Preferably, the treating step comprises laser treatment of the portionof the surface.

Preferably, the power of the laser is set such that it does not removeall of the surface material from said portion of the surface of theworkpiece, but removes at least the surface oxide layer from the mark.

Preferably, the treating step is applied to a whole of the surface ofthe workpiece carrying the mark.

Preferably, the steps of deepening the mark relative to the surface toform a first depth and depositing the filling material into the firstdepth is conducted substantially simultaneously under an electrochemicalreaction between an acidic, metal ion-containing electrolyte solutionand a material at the mark.

Preferably, the material at the mark is dissolved by the acidicelectrolyte solution to generate the first depth prior to thedisposition of the filing material into the first depth.

Preferably, the workpiece comprises a first thickness prior to thechemical process, wherein the first depth and the first thickness are ofa ratio ranged from 0.05:0.5 to 0.07:10.

Preferably, the workpiece comprises a second thickness after thechemical process, wherein the second depth and the second thickness areof a ratio ranged from 0.07:0.3 to 0.1:9.8.

Preferably, the mark carried by the surface of the workpiece comprisesany one or any combination of numerals, characters, signs, logos, orpictures.

In a second main aspect, the invention provides a method of treating ametallic workpiece to preserve a mark on the surface of the workpiece,the method comprising the step of: treating at least a portion of thesurface of the work piece surrounding the mark to remove at least asurface oxide layer from the mark, the treating step being arranged suchthat it does not remove all of the surface material from said portion ofthe surface of the workpiece, but removes at least the surface oxidelayer from the mark.

Preferably, the treating step comprises laser treatment of the portionof the surface.

Preferably, the power of the laser is set such that it does not removeall of the surface material from said portion of the surface of theworkpiece, but removes at least the surface oxide layer from the mark.

Preferably, the treating step is applied to a whole of the surface ofthe workpiece carrying the mark.

Preferably, the mark carried by the surface of the workpiece comprisesany one or any combination of numerals, characters, signs, logos, orpictures.

In a third main aspect, the invention provides a method of selectivelygenerating a depth at an etch or anneal mark of an anodized metallicworkpiece, comprising: treating a surface of the workpiece carrying theetch or anneal mark to remove at least a surface oxide layer from theetch or anneal mark; and reacting a material of the etch or anneal markwith an acidic solution to deepen the etch or anneal mark.

Preferably, the treating step comprises laser treatment of the surface.

Preferably, the treating step being arranged such that it does notremove all surface material from said surface of the workpiece, butremoves at least the surface oxide layer from the etch or anneal mark.

Preferably, the reacting step comprises an electrochemical reactionbetween an acidic, metal ion-containing electrolyte solution and amaterial at the etch mark.

Preferably, the material at the etch mark is dissolved by the acidicelectrolyte solution to generate the depth at the etch mark.

Preferably, the reacting step is performed on a portion of the surfaceof the workpiece surrounding the etch mark.

Preferably, the etch or anneal mark carried by the surface of theworkpiece comprises any one or any combination of numerals, characters,signs, logos, or pictures.

In a fourth main aspect, the invention provides a method of selectivelydepositing a filling material into a depth provided at a mark formed inan anodized metallic workpiece, comprising the step of: reacting a metalion-containing electrolyte solution at the depth during anelectrochemical reaction.

Preferably, the electrochemical reaction simultaneously removes amaterial from the depth to thereby increase magnitude of the depth whiledepositing the filing material into the depth.

Preferably, the metal ion-containing electrolyte solution is acidic.

Preferably, the filling material is adapted to be removed from theworkpiece during a subsequent chemical etching process on the workpiece.

Preferably, the depositing step is conducted by applying the electrolytesolution selectively at the depth by a conducting tool connected to ananode of a power supply during the electrochemical reaction.

Preferably, the workpiece is connected to a cathode of the power supplyduring the electrochemical reaction.

Preferably, the mark carried by the surface of the workpiece comprisesany one or any combination of numerals, characters, signs, logos, orpictures.

In a fifth main aspect, the invention provides a method of selectivelyremoving at least an oxide layer from an anodized metallic workpiece,the workpiece comprising at least one first region and at least onesecond region, wherein the first region is physically and/or chemicallyweaker than the second region, the method comprising the step of: lasertreating the workpiece to thereby remove at least a surface oxide layerfrom the first region without removing all of a surface material layerof the second region.

In a sixth main aspect, the a method for preserving a mark carried by asurface of a metallic workpiece, the method comprising the steps of:deepening the mark relative to the surface; and treating at least aportion of the work piece surrounding said mark to remove the surfacematerial from said portion of the work piece without removing the mark.

In a seventh main aspect, there is provided a workpiece produced by anyof the methods according to the invention.

The summary of the invention does not necessarily disclose all thefeatures essential for defining the invention; the invention may residein a sub-combination of the disclosed features.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and further features of the present invention will beapparent from the following description of preferred embodiments whichare provided by way of example only in connection with the accompanyingfigures, of which:

FIG. 1 is a schematic diagram showing a front view of an anodizedmetallic workpiece in the form of a housing of a portable electronicdevice;

FIG. 2 is a side view of the workpiece of FIG. 1 showing an upper oxidelayer and a metallic substrate layer;

FIG. 3 is a schematic cross-sectional diagram showing the “weakened”oxide layer at a region of the surface of the workpiece where a mark islocated;

FIG. 4 is a schematic diagram showing a laser treatment process on thesurface of the metallic workpiece carrying the mark as indicated in FIG.3;

FIG. 5 is a schematic diagram showing the surface of the metallicworkpiece after the laser treatment of FIG. 4;

FIG. 6 is a schematic diagram showing an electrochemical reactionconducted at the location of the mark after the oxide layer is removedafter the laser treatment of FIG. 4;

FIG. 7 shows the relevant set up and steps to conduct theelectrochemical reaction of FIG. 6; and

FIG. 8 is a schematic diagram showing a metallic material deposited atthe mark after the electrochemical reaction of FIGS. 6 and 7.

DESCRIPTION OF PREFERRED EMBODIMENTS

The following description is of preferred embodiments by way of exampleonly and without limitation to the combination of features necessary forcarrying the invention into effect.

Reference in this specification to “one embodiment” or “an embodiment”means that a particular feature, structure, or characteristic describedin connection with the embodiment is included in at least one embodimentof the invention. The appearances of the phrase “in one embodiment” invarious places in the specification are not necessarily all referring tothe same embodiment, nor are separate or alternative embodimentsmutually exclusive of other embodiments. Moreover, various features aredescribed which may be exhibited by some embodiments and not by others.Similarly, various requirements are described which may be requirementsfor some embodiments but not other embodiments.

In the claims hereof, any element expressed as a means for performing aspecified function is intended to encompass any way of performing thatfunction. The invention as defined by such claims resides in the factthat the functionalities provided by the various recited means arecombined and brought together in the manner which the claims call for.It is thus regarded that any means that can provide thosefunctionalities are equivalent to those shown herein.

The present invention relates to a method for preserving one or moremarks on a metallic workpiece. Particularly, the invention relates to amethod for preserving one or more marks on a metallic workpiece prior toa chemical process to remove a surface material from a surface of theworkpiece carrying the marks, which would otherwise be removed by thechemical process.

During a refurbishing process for a metallic workpiece which normallyrequires one or more surface processing steps, an etching solution suchas caustic soda can be used to remove the surface materials such as thesurface oxide layer covering the substrate and/or at least some of thesubstrate materials of the workpiece so as to provide a “clean” surfacefor the subsequent surface finishing steps. Caustic etching is anon-selective chemical process and accordingly, any markings such assigns or logos which are previously introduced to the surface of theworkpiece will also be removed along with the other surface materials ofthe workpiece. However, in many circumstances it is desirable for thesemarkings to be retained so that the original appearance of the workpiececan be well restored after the refurbishment.

In one embodiment of the present invention, there is provided a methodfor preserving a mark such as, for example, an etch or anneal mark on ametallic workpiece prior to a chemical process such as, for example, achemical etching process to remove a surface material from a surface ofthe workpiece carrying the mark. The method comprises the steps ofdeepening the mark relative to the surface to form a first depth; anddepositing a filling material into the first depth, wherein the fillingmaterial is adapted to be removed during the chemical etching process,such that a second depth is obtained at the mark after the chemicalprocess. Particularly, the second depth is of a sufficient distance fromthe surface such that the mark can be substantially retained on thesurface of the workpiece even after further surface finishing steps ofthe workpiece such as, but not limiting to, surface polishing, blasting,buffering and/or anodizing, etc.

Referring to FIGS. 1 and 2, shown is a metallic workpiece 10 in the formof a housing for a portable electronic device such as a mobile phone, atablet PC or the like. In one embodiment, the workpiece 10 can becomposed of one or more metal or metal compounds such as, but notlimited to, aluminum metal and/or aluminum alloys (hereinafter referredto as “aluminum”). In one further embodiment, the aluminum workpiece 10can be anodized, i.e. one or more surfaces of the workpiece 10 have beencoated with an oxide layer 20, or have increased thickness of thenatural oxide layer on the surface 15 of the workpiece 10. Anodizationcan be conducted by any known electrolytic processes, with the resultingoxide layer capable of improving resistance to corrosion and wear of theworkpiece 10 and also facilitating the subsequent surface finishingprocedures for the workpiece 10.

It is not uncommon for the surface of the housing 10 of a portableelectronic device to be provided with markings 12 such as one or more ofa numeral, character, sign, logo, picture and their combinations whichindicates information of the device such as its brand name or modelnumber etc. These markings 12 can be introduced to the surface of thehousing by any etching or annealing means such as chemical etching,photo-annealing, electromagnetic beam annealing and/or physicalengraving, etc. Experience shows that different processes of etching orannealing may impose different degrees of adverse effects on thephysical and/or chemical properties of the surface material of theworkpiece 10. For example, surface material of an etch or anneal mark 12may generally comprise a surface oxide layer 20A which is substantially“weaker” than the surface oxide layer 20B of the other, non-etch markregions of the surface of the workpiece 10, as shown in FIG. 3.

In one embodiment, it is provided a step of treating at least a portionof the surface of the workpiece 10 surrounding the mark 12 to therebyremove at least the weakened surface oxide layer 20A (FIG. 3) from theetch or anneal mark 12 prior to the step of deepening the mark 12relative to the surface to form a first depth. As shown in FIG. 4, thetreating step may involve a laser source 30 adapted to emit laserradiation to the portion of the surface of the workpiece 10 surroundingthe mark 12 or to a whole of the surface of the workpiece, and the stepis arranged such that the laser does not remove all of the surfacematerial from said portion of the surface of the workpiece 10 includingthe region covered by the stronger oxide layer 20B, but does remove atleast the weakened surface oxide layer 20A from the mark 12, as shown inFIG. 5. This selective removal of the surface oxide layer 20A isachieved by the difference in composition of the surface oxide layers20A and 20B due to the previous etching or annealing action to form theoriginal etch or anneal mark 12. As mentioned, etching or annealingsubstantially “weakens” the surface oxide layer by reducing thethickness and/or weakening the physical and/or chemical properties ofthe oxide layer, so that the weakened surface oxide layer 20A will bemore susceptible to be removed by the laser treatment.

The laser treatment may comprise radiation from one or more of aninfrared laser at a wavelength of 1064 nm, a green type laser at awavelength of 532 nm for aluminum, CO₂ laser, and any other type oflasers which are applicable for this purpose. Particularly, the power ofthe laser 30 is set such that it does not remove all of the surfacematerial from said portion of the surface of the workpiece 10, butremoves at least the surface oxide layer 20A from the mark 12. In oneembodiment, at least one of the parameters such as power, frequency,velocity, distance from the sample material and duration of radiation ofthe laser 30 can be controlled such that the surface oxide layer 20A andoptionally, a portion of the aluminum at the etch mark 12 is removed bythe laser treatment. For example, an infrared laser (brand: SEI laser,model: G8 Laser³) operated at a power of about 60%, a frequency of about40 KHz and a velocity of about 3000 mm/s, with the tip of the laser beampositioned at about 170 mm from the surface of the sample workpiecewould be sufficient to remove the surface oxide layer 20A from theworkpiece 15 without removing all of the surface oxide layer 20B fromthe surface of the workpiece 15.

The step of laser treating the surface of the workpiece 15 to remove thesurface oxide layer 20A is followed by the step of deepening the mark 12relative to the surface of the workpiece 12 to form a first depth 40.Specifically, the step of deepening comprises reacting the material ofthe mark 12, with its protective surface oxide layer 20A removed duringthe prior laser treatment step, with an acidic solution. The mechanismto remove the metal or metal compound by an acidic solution is based onthe Reduction-Oxidation (Redox) reaction between the metal and acid,with a consequence that a certain amount of the substrate metalmaterials at the mark 12 being dissolved to form a first depth 40.Preferably, the acidic solution is selectively applied on the surface atand surround the mark 12 to selectively generate a depth at the specificregion of the etch mark 12. The depth of the first depth 40 can bedependent on, for example, at least one of the reactivity of the metalsubstrate, the strength of the acid, and the duration of the redoxreaction. In one embodiment, by applying an acidic ferric chloridesolution on and around the aluminum surface of the unprotected mark 12for about 30 s to 60 s would generate a depth of about 0.04 mm to 0.07mm. In yet a further embodiment, the first depth 40 and the thickness ofthe workpiece 10 (assuming having a substantially uniform thickness)prior to the caustic etching process can be of a ratio ranged from0.05:0.5 to 0.07:10. Particularly, it is preferred to limit the reactiontime to about and less than 60 s as it is observed that reaction betweenthe metal surface and the acid for more than 90 s would affect not onlythe unprotected metal substrate, but also the other adjacent regionseven if they are protected by the surface oxide layer, which will resultin a deformation of the mark 12.

After a first depth 40 is formed at the mark 12 by the acid treatment,the next step is to deposit a filling material into the first depth 40.Preferably, the filling material comprises one or more metallicmaterials including pure metals, metal alloys and/or metal compounds.More preferably, the filling metallic material is different to themetallic material of the workpiece 12. The filling material is adaptedto be removed during the subsequent caustic etching process, such that asecond depth 60 can be obtained at the mark 12 after the etchingprocess. Preferably, the filling material is adapted to be removedpreferentially when compared to the other materials of the workpiece 10during the caustic etching process.

It is understandable that the second depth 60 would be of a magnitudeequal to or more than that of the first depth 40, which is due to thesubsequent caustic etching of the material underneath the fillingmaterial and the succeeding surface finishing steps which remove thesurface materials of the workpiece 10. In one embodiment, the seconddepth 60 and the thickness of the workpiece 10 (assuming having asubstantially uniform thickness) after the caustic etching process canbe of a ratio ranged from 0.07:0.3 to 0.1:9.8.

Specifically, the step of depositing the filling metallic material intothe first depth 40 comprises an electrochemical reaction in the presenceof a metal ion-containing electrolyte solution at the first depth 40 ofthe mark 12 during a metal substitution process. In one embodiment, thesteps of deepening of the mark 12 to form the first depth 40 anddepositing the filling material into the first depth 40 can be conductedsubstantially simultaneously under an electrochemical reaction betweenan acidic, metal ion-containing electrolyte solution and a material atthe mark 12, with the material at the mark 12 being dissolved by theacidity of the electrolyte solution to generate the first depth 40 priorto the disposition of the filing material into the first depth 40 duringthe electrochemical, metal substitution process. In a furtherembodiment, the electrochemical reaction may simultaneously remove amaterial from the depth 40 to thereby increase magnitude of the depthwhile depositing the filling material into the depth.

An embodied setup of the described processes is illustrated in FIGS. 6to 7. As shown in the figures, an acidic, metal ion-containingelectrolyte solution 70 such as aqueous ferric chloride solution (FeCl₃(aq)) is applied selectively on a portion of the surface at and surroundthe etch mark 12, with the etch mark 12 being previously treated withlaser to remove the surface oxide layer 20A. In one embodiment, theselective application of the FeCl₃ (aq) to the specific region of mark12 can be conducted by a typical brush electroplating arrangement.Specifically, the brush 72, generally an anode wrapped with a clothmaterial saturated with the plating, electrolyte solution 70, isconnected to the positive terminal of a low voltage direct-current powersource 80, and that the workpiece 10 is connected to the cathode of thepower source 80. To facilitate the electrochemical reaction, an operatormay dip the brush 72 into the electrolyte solution 70 and then apply thesolution at and surround the surface of the mark 12. This action evenlydistributes the acidic electrolyte solution 70 on to the mark 12, sothat the metallic substrate material at the mark can be continuouslydissolved by the acid to thereby deepen the first depth 40.Simultaneously, the metal ions at the electrolyte can be continuouslyreduced to deposit the filling metallic material into the first depth40. As mentioned earlier, the duration of the electrochemical reactionis preferred to be limited to no more than 60 s as it is observed thatreaction for more than 90 s would affect also substantially thecomposition of surface regions other than the mark 12. FIG. 8 shows aschematic diagram of the first depth 40 being deposited with a fillingmetal material 60 after the electrochemical processes of FIGS. 6 and 7.

Although the use of aqueous ferric chloride solution has been describedin the above electrochemical reaction, any metal ion-containingelectrolyte solutions which are considered suitable and applicable foruse in an electrochemical, metal substitution reaction at the metallicworkpiece should also be encompassed. Examples of the preferred metalions of the electrolyte include, but are not limited to, iron ions,copper ions, silver ions, aluminum ions, nickel ions and zinc ions.Example of the electrolyte may include, for example, zinc chloridesolution, nickel (II) chloride solution, copper (II) chloride solutionetc. Particularly, any electrolyte solutions which include metal ionswhich satisfy the “Hume-Rothery rules” (Foundations of Materials Scienceand Engineering, 4th ed., W. Smith and J. Hashemi, p. 139-140 (2006))which describe the conditions to undergo a solid substitutionalreaction, would be applicable.

After the deposition of the filling material 60 into the first depth 40,the workpiece 10 will be surface treated by caustic etching, forexample, by submerging the workpiece 10 into a bath of alkaline, causticsolution. The filling material 60 at the mark 12 will be dissolved andremoved at a faster rate than the surface materials of the anodizedsurface of the workpiece 10. By controlling the duration of thereaction, temperature of the reaction and/or strength (e.g. alkalinity)of the caustic solution, surface of the workpiece 10 can be etched at acontrolled manner with at least the filling material 60 at the mark 12be removed so as to retain the mark 12 after the chemical etchingprocess.

Although only workpiece of aluminum is embodied in the above describedexamples, a person skilled in the art would appreciate that workpiecewhich comprises other metallic materials should also be encompassed, aslong as they are considered suitable and applicable for the presentinvention.

Similarly, although alkaline, aqueous sodium hydroxide solution (NaOH(aq)) or caustic soda is embodied in the above described examples, aperson skilled in the art would appreciate that any etching solutionsuch as potassium hydroxide solution, calcium hydroxide solution, bariumhydroxide solution etc. should also be encompassed, as long as they areconsidered suitable and applicable for the current purpose.

1-20. (canceled) 21: A method for preserving a mark on a surface of ametallic workpiece, the method comprising the steps of: deepening themark relative to a metallic surface of the workpiece to form a firstdepth; and depositing a metallic filling material into the first depth,wherein the metallic filling material is removed during a subsequentchemical process, such that a second depth is obtained at the mark afterthe chemical process. 22: The method according to claim 1, wherein themark on the metallic workpiece comprises an etch or anneal mark and thechemical process is a chemical etching process. 23: The method accordingto claim 1, wherein the step of deepening the mark relative to themetallic surface of the workpiece to form the first depth comprisesreacting a surface of the mark with an acidic solution. 24: The methodaccording to claim 1, wherein the metallic filling material is adifferent metallic material to that of the workpiece. 25: The methodaccording to claim 1, wherein the step of depositing the metallicfilling material comprises an electrochemical reaction in the presenceof a metal ion-containing electrolyte solution at the first depth of themark. 26: The method according to claim 1, wherein the chemical lprocess comprises etching with an alkaline solution. 27: The methodaccording to claim 1, wherein the surface of the workpiece is anodized.28: The method according to claim 1, wherein the chemical processcomprises removing at least an oxide layer from the surface of theworkpiece. 29: The method according to claim 1, further comprising astep of treating the surface of the workpiece carrying the mark prior tothe step of deepening the mark to form a first depth. 30: The methodaccording to claim 9, wherein the treating step comprises removing atleast a surface oxide layer from the mark. 31: The method according toclaim 10, wherein the treating step is applied to at least a portion ofthe surface of the work piece surrounding the mark, but is such that itdoes not remove all of the surface material from said portion of thesurface of the workpiece, but removes at least the surface oxide layerfrom the mark. 32: The method according to claim 11, wherein thetreating step comprises laser treatment of the portion of the surface.33: The method according to claim 12, wherein the power of the laser isset such that it does not remove all of the surface material from saidportion of the surface of the workpiece, but removes at least thesurface oxide layer from the mark. 34: The method according to claim 1,wherein the steps of deepening the mark relative to the metallic surfaceof the workpiece to form a first depth and depositing the metallicfilling material into the first depth is conducted simultaneously underan electrochemical reaction between an acidic, metal ion-containingelectrolyte solution and a material at the mark. 35: The methodaccording to claim 14, wherein the metallic material at the mark isdissolved by the acidic electrolyte solution to generate the first depthwhilst depositing the metallic filing material into the first depth. 36:A method of selectively generating a depth at an etch mark of ananodized metallic workpiece, comprising: treating a surface of theworkpiece carrying the etch mark to remove at least a surface oxidelayer from the etch mark; reacting a material of the etch mark with anacidic solution after removal of at least the surface oxide layer by thetreating step to generate a first depth at a metallic surface of theworkpiece; and depositing a metallic filling material into the firstdepth; and removing the metallic filling material to form a seconddepth. 37: The method according to claim 16, wherein the treating stepcomprises laser treatment of the surface. 38: The method according toclaim 16, wherein the treating step being arranged such that it does notremove all surface material from said surface of the workpiece, butremoves at least the surface oxide layer from the etch mark. 39: Themethod according to claim 16, wherein the reacting step and thedepositing step comprise an electrochemical reaction between an acidic,metal ion-containing electrolyte solution and a material at the etchmark. 40: A method for preserving a mark on a surface of a metallicworkpiece, the method comprising the steps of: deepening the markrelative to a metallic surface of the workpiece to form a first depth;and depositing a metallic filling material into the first depth; whereinthe steps of deepening the mark relative to the metallic surface of theworkpiece to form a first depth and depositing the metallic fillingmaterial into the first depth are conducted simultaneously under anelectrochemical reaction between an acidic, metal ion-containingelectrolyte solution and a material at the mark.